澳洲幸运5彩开奖
At LeeMAH, your electronics manufacturing challenges are our own!
We are building on over 40 years of experience in electronics technology at LeeMAH Electronics Our high-tech capabilities have kept pace with the digital age, enabling us to offer the industry’s highest quality and most efficient printed circuit board (PCB) assembly services. Providing PCBs for all different types of equipment, we have fulfilled the most complex requirements for customers in the most demanding industries. These have included communications, instrumentation, medical devices, transportation, professional audio, and the military, among others.
A complete array of turnkey PCB manufacturing solutions is available. These include surface mount technologies that are specially designed for accuracy, flexibility, and high speed. We also provide pin thru-hole assembly for projects ranging from the simple to highly complex boards that require hundreds of components. Additional capabilities include ball grid array (BGA) assembly, burn-in, conformal coating, RTV encapsulation, and flexible circuit assemblies. We regularly assemble rigid, flexible, rigid/flexible, single- and double-sided PCBs, in package sizes that include FBGA, LGA, and QFN. We work with PCBs in a broad range of dimensions, including lengths and widths from 2” to 18” and thicknesses from .031” to .125”.
None of our premium quality PCBs would be possible without our complete array of advanced equipment. These systems include a convection reflow oven, ionic contamination tester, Juki pick and place equipment, dispatch ovens, desiccant chambers, and a host of others. We work in quantities ranging from prototypes to high volume runs, with lead times averaging just two weeks. The quality of our work is backed up by multiple certifications, including AS9100D, ISO 9001:2015, ITAR, and many others.
To find out more about our PCB assembly capabilities, please see the details in the following table or contact us directly.
澳洲幸运5微信群
- General Capabilities
-
- Surface Mount Technology
Pin Thru-Hole
Ball Grid Array
Functional, Flying Probe, Boundary Scan and In-Circuit Testing - Burn-In
Conformal Coating
RTV Encapsulation
Flexible Circuit
- Surface Mount Technology
- Equipment
-
- Automated Screen Printing
AOI – Automated Optical Inspection
Convection Reflow Oven
General Products Lead Forming
Juki Pick and Place Equipment
Wave Soldering (RoHS and Lead)
In-Line and Batch Washers
Ionic Contamination Tester
2D X-Ray
RoHS XRF Analyzer -
Metcal Solder Stations
Agilent 3070 ICT
Acculogic Flying Probe
Thermotron Environmental Chamber
Desiccant Chambers
Dispatch Ovens
Automated Board Handlers
De-Paneling Equipment
- Automated Screen Printing
- Printed Circuit Board Assembly
-
- Ball Grid Array
Clean and No Clean Flux Systems
Rigid, Flexible and Rigid / Flexible
Single & Double-Sided
Placement down to 01005
Package Sizes
- FBGA
- LGA
- QFN
- Metal Core Insulated
Mixed Technology (SMT and Thru Hole)
RoHS and Leaded Process
- Ball Grid Array
- Assembly Methods
-
- Automated Assembly
Hand Insertion
Hand Soldering - Reflow
Wave Solder
- Automated Assembly
- Additional Services Provided
- Conformal Coating
Repair & Refurbishment
- Length
-
- Min
2” - Max
18"
- Min
- Width
-
- Min
2" - Max
18"
- Min
- Thickness
-
- Min
.031" - Max
.125"
- Min
- Lead Time (Manufacturing)
- Standard 2 weeks
- Production Volume
- Low Volume to High Volume
Prototype
Additional Information
- Industry Focus
-
- Communications
Industrial
Instrumentation
Medical Devices - Military / Aerospace
Transportation
Professional Audio
- Communications
- Industry Standards
- AS9100D/ISO-9001:2015 Certification
NIST Standards
MIL-STD-45662
IPC 610 Class II & III standards
RoHS compliant
ITAR Registered
FDB Device License
NCSDC Certification
- File Formats
- AutoCAD(DWG)
DXF - Drawing Exchange Format
Microsoft Excel
GIF - Graphics Interchange Format
JPEG - Joint Photographic Experts Group
PDF - Portable Document Format
TIFF - Tagged Image File Format
SolidWorks
Gerber
ODB++
CADASCII
Print This Page